Display device and assembling method thereof

ABSTRACT

A light-emitting assembly includes a substrate and a plurality of light-emitting elements. The substrate includes a component arrangement region and a planar region in a top view, and includes a base material layer, a filled layer and a protection layer in a sectional view. A thickness of the filled layer is greater than a thickness of the protection layer. The thickness of the protection layer is greater than 0 μm and less than 30 μm. The plurality of light-emitting elements are located on the component arrangement region. This disclosure can improve the non-uniform brightness issue (hotspots) or enhance the optical performance.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation Application (CA) of an earlier filed,pending, application having application Ser. No. 17/164,057 and filed onFeb. 1, 2021, which is a Continuation Application (CA) of Ser. No.16/400,494 and filed on May 1, 2019, which claims priority under 35U.S.C. § 119(a) on Patent Application No(s). 201810436224.5 filed inPeople's Republic of China on May 9, 2018, the entire contents of which,including drawings, are hereby incorporated by reference.

BACKGROUND Technical Field

The present disclosure relates to a display device and an assemblingmethod thereof that can improve the non-uniform brightness issue(hotspots).

Related Art

In the recent years, the manufacturing processes and materials oflight-emitting diodes (LEDs) have been developed and improved, so thelight-emitting efficiency of LEDs is sufficiently increased. Differentfrom the general fluorescent lamps or compact lamps, the LEDs have theproperties such as low power consumption, long lifetime, high safety,short lighting response time, and small volume. Accordingly, the LEDshave been used in the illumination application, such as the indoorlamps, flashlights, headlights for vehicles, or other lighting devices,or in the backlight module of flat display displays.

For example, the LEDs can be used in the edge-type backlight module of aliquid crystal display (LCD) device. Generally, the edge-type backlightmodule includes a light-emitting assembly and a light-guiding platedisposed correspondingly to the light-emitting assembly. Thelight-emitting assembly is, for example, an LED light bar, which islocated on the side of the light-guiding plate and emits light into thelight-guiding plate. The function of the light-guiding plate is to guidethe transmission direction of light and to provide a uniform surfacelight source by total reflection of the light-guiding plate.

In the design of current light-emitting assembly, a groove is formed onthe front side of the light-emitting element, so that the traces orelectrical conductive film layers in different electrical properties canbe electrically isolated from each other. However, the groove can easilycause bubbles in the adhesive member. The bubbles can make the adhesivemember be peeled off, and the light-guiding plate cannot be fixed,resulting in a non-uniform brightness issue (hotspots) or affecting theoptical performance.

SUMMARY

An objective of this disclosure is to provide a display device and anassembling method thereof that can improve the non-uniform brightnessissue (hotspots) or enhance the optical performance of the displaydevice.

This disclosure provides a display device comprising a backlight module.The backlight module comprises a light-guiding plate, a light-emittingassembly and an adhesive member. The light-emitting assembly is disposedcorrespondingly to the light-guiding plate and comprises a substrate anda plurality of light-emitting elements. The substrate comprises a firstsurface, and the first surface comprises a component arrangement regionand a planar region. A first gap is formed between the planar region andthe component arrangement region, and the planar region and thecomponent arrangement region are electrically isolated from each other.The light-emitting elements are disposed on the component arrangementregion. The adhesive member connects the light-guiding plate and theplanar region.

This disclosure also provides as assembling method of a display device,comprising: providing a light-guiding plate; providing a light-emittingassembly disposed correspondingly to the light-guiding plate, whereinthe light-emitting assembly comprises a substrate and a plurality oflight-emitting elements, the substrate comprises a first surface, thefirst surface comprises a component arrangement region and a planarregion, a first gap is formed between the planar region and thecomponent arrangement region, the planar region and the componentarrangement region are electrically isolated from each other, and thelight-emitting elements are disposed on the component arrangementregion; disposing an adhesive member on the planar region or thelight-guiding plate; and connecting the light-guiding plate and theplanar region of the substrate by the adhesive member.

As mentioned above, in the display device and assembling method thereofof this disclosure, the first surface of the substrate of the backlightmodule comprises a component arrangement region and a planar region, theplanar region and the component arrangement region are electricallyisolated from each other by a gap disposed therebetween, and theadhesive member connects the light-guiding plate and the planar region.Since the planar region of the substrate is substantially a planarstructure, the bubbles can be prevented to be formed in the adhesivemember so as to obtain a substantially planar surface. Accordingly,after the light-guiding plate is disposed on the adhesive member, theadhesive member will not be easily peeled, thereby solving thenon-uniform brightness issue (hotspots) or enhancing the opticalperformance.

BRIEF DESCRIPTION OF THE DRAWINGS

The embodiments will become more fully understood from the detaileddescription and accompanying drawings, which are given for illustrationonly, and thus are not limitative of the present disclosure, andwherein:

FIG. 1A is a sectional view of a display device according to anembodiment of this disclosure;

FIG. 1B is a schematic perspective diagram showing a light-emittingassembly and a light-guiding plate of the display device of FIG. 1A;

FIG. 2A is a top view of a part of the first surface of the substrateaccording to an embodiment of this disclosure;

FIG. 2B is a top view of a part of the second surface of the substrateaccording to an embodiment of this disclosure;

FIG. 2C is a sectional view of the substrate of FIG. 2A along the lineA-A;

FIG. 3 is a circuit diagram of the light-emitting element according toan embodiment of this disclosure;

FIG. 4A is a circuit diagram of the light-emitting element according toanother embodiment of this disclosure;

FIG. 4B is a top view of a part of the front surface of the substrateaccording to another embodiment of this disclosure;

FIG. 4C is a top view of a part of the front surface of the substrateaccording to another embodiment of this disclosure;

FIGS. 5A and 5B are flow charts showing the assembling procedure of thedisplay device according to an embodiment of this disclosure; and

FIG. 6 is a schematic diagram showing a display device according toanother embodiment of this disclosure.

DETAILED DESCRIPTION OF THE DISCLOSURE

The embodiments of the disclosure will be apparent from the followingdetailed description, which proceeds with reference to the accompanyingdrawings, wherein the same references relate to the same elements.

The component substrates, display devices, and manufacturing methods ofthe display device according to some embodiments of this disclosure willbe described hereinafter. To be noted, the following examples showdifferent aspects of some embodiments of this disclosure. The specificelements and arrangements described below are merely illustrative ofsome embodiments of the present disclosure. Of course, these are used asexamples and not as a limitation of the present disclosure. Moreover,repeated reference numbers or labels may be used in differentembodiments. These repeated reference numbers or labels are merelyillustrative of some embodiments of the present disclosure and are notintended to represent any relationships of the various discussedembodiments and/or structures. Furthermore, when describing that a firstmaterial layer is disposed on or above a second material layer, thefirst material layer can be in direct contact with the second materiallayer. Alternatively, this description is also possible to be realizedas having one or more material layers interposed between the firstmaterial layer and the second material layer, in which case the firstmaterial layer and the second material layer are not in direct contactwith each other.

With regard to “approximately” as used in this disclosure, the error orrange of the value is generally within 20 percent, preferably within 10percent, and more preferably within 5 percent, 3 percent, 2 percent, 1percent, or 0.5 percent. In the absence of a clear statement in thedisclosure, the values mentioned are all considered to be approximatevalues. That is, the values mentioned have an error or range representedby “approximately”.

FIG. 1A is a sectional view of a display device according to anembodiment of this disclosure, and FIG. 1B is a schematic perspectivediagram showing a light-emitting assembly and a light-guiding plate ofthe display device of FIG. 1A.

As shown in FIGS. 1A and 1B, a display device 1 comprises a backlightmodule 2 and a display panel 3, which are disposed correspondingly toeach other. The light emitted from the backlight module 2 can passthrough the display panel 3 to display an image.

The backlight module 2 comprises a light-guiding plate 21, alight-emitting assembly 22 and an adhesive member 23. The light-emittingassembly 22 is disposed correspondingly to the light-guiding plate 21.The light-guiding plate 21 has a light input surface 211 and a lightoutput surface 212. For example, the light emitted from thelight-emitting assembly 22 can enter the light-guiding plate 21 throughthe light input surface 211, and exit the light-guiding plate 21 throughthe light output surface 212. The light-guiding plate 21 comprises atransparent material, such as acrylic resin, polycarbonate, polyethyleneresin or glass, and this disclosure is not limited thereto. In addition,the cross-section shape of the light-guiding plate 21 can be, forexample, rectangular or a wedge shape. In this embodiment, thelight-guiding plate 21 has a rectangle shape. To be noted, in otheraspects, another light-emitting assembly (not shown) can be provided atan opposite side of the light input surface 211 of the light-guidingplate 21, so that the lights emitted from the two light-emittingassemblies can pass through the opposite light input surfaces,respectively, to enter the light-guiding plate 21. This disclosure isnot limited.

The light-emitting assembly 22 comprises a substrate 221 and a pluralityof light-emitting elements 222. The substrate 221 can be a flexiblecircuit substrate, a printed circuit board, a rigid-flex board, or anyof other suitable substrates. In this embodiment, the substrate 221 is aflexible circuit substrate, such as a flexible printed circuit (FPC)board. The flexible circuit substrate can comprise, for example but notlimited to, polyimide (PI). The substrate 221 comprises a first surfaceS1 and a second surface S2 disposed correspondingly to the first surfaceS1 (see FIG. 1B). In this embodiment, the first surface S1 can be theupper surface (front surface) of the substrate 221, and the secondsurface S2 can be the lower surface (rear surface) of the substrate 221.The light-emitting elements 222 are disposed on the substrate 221 alongthe direction D1. In this embodiment, as shown in FIG. 1B, the directionD1 is parallel to the light input surface 211 of the light-guiding plate21. The light-emitting elements 222 are separately disposed on the firstsurface S1 of the substrate 221 along the direction D1. Thelight-emitting elements 222 comprise light-emitting diodes (LEDs),organic light-emitting diodes (OLEDs), micro light-emitting diodes(micro LEDs), or mini light-emitting diodes (mini LEDs). In thisembodiment, the light-emitting elements 222 are LED light bar forexample. In some embodiments, the chip size of the LEDs approximatelyranges from 300 μm to 10 mm, the chip size of the mini LEDsapproximately ranges from 100 μm to 300 μm and the chip size of themicro LEDs approximately ranges from 1 μm to 100 μm. This disclosure isnot limited thereto.

FIG. 2A is a top view of a part of the first surface of the substrateaccording to an embodiment of this disclosure, FIG. 2B is a top view ofa part of the second surface of the substrate according to an embodimentof this disclosure, and FIG. 2C is a sectional view of the substrate ofFIG. 2A along the line A-A. Herein, FIG. 2A shows the top view of a partof the first surface S1 (the front surface) of the substrate 221, andFIG. 2B shows the bottom view of a part of the second surface S2 (therear surface) of the substrate 221.

Referring to FIGS. 1A, 1B and 2A, in this embodiment, the first surfaceS1 comprises a component arrangement region S11 and a planar region S12.A first gap d1 is formed between the planar region S12 and the componentarrangement region S11, and the planar region S12 and the componentarrangement region S11 are electrically isolated from each other. Inthis embodiments, the planar region S12 and the component arrangementregion S11 are electrically isolated by the first gap d1. The first gapd1 can be greater than 0 mm and less than 0.3 mm (0 mm≤d1≤0.3 mm). Insome embodiments, the first gap d1 is greater than 0.1 mm and less than0.2 mm (0.1 mm≤d1≤0.2 mm). For example, the first gap d1 can be 0.15 mm.In one embodiment, an insulation material can be disposed between theplanar region S12 and the component arrangement region S11, so theplanar region S12 and the component arrangement region S11 can beelectrically insulated from each other. The width of the insulationmaterial is equal to the first gap d1. In addition, the first gap d1 hasan extension direction. As shown in FIGS. 2A and 2B, the light-emittingelements 222 are arranged along the extension direction, which is theabove-mentioned direction D1.

In addition, the component arrangement region S11 comprises a pluralityof pairs of electrical connection pads P1 and P2 (see FIG. 2A), so thatthe two electrodes (not shown) of the light-emitting element 222 can bedisposed on the component arrangement region S11 through thecorresponding pair of electrical connection pads P1 and P2. In someembodiments, a minimum distance d3 between the planar region S12 and theelectrical connection pads P1 and P2 is between 0.075 mm and 0.3 mm(0.075 mm≤d3≤0.3 mm).

The light-guiding plate 21 is disposed on the planar region S12 (seeFIG. 1B), and the light-emitting elements 222 are arranged along thedirection D1 and disposed on the component arrangement region S11 (seeFIGS. 1B and 2A) corresponding to the light input surface 211 of thelight-guiding plate 21. In one embodiment, the adhesive member 23 isattached to and disposed on the planar region S12 (see FIG. 1B). Theadhesive member 23 can be, for example but not limited to, adouble-sided tape or formed by applying and curing an adhesive material.The adhesive member 23 connects the light-guiding plate 21 and theplanar region S12, so that the light input surface 211 of thelight-guiding plater 21 is disposed facing the light-emitting elements222.

To be noted, the above-mentioned component arrangement region S11 is aregion of the substrate 221 for configuring the light-emitting elements222 (e.g. LEDs) and/or other elements. The planar region S12 isseparated from the component arrangement region S11 by a first gap d1and is not configured with the light-emitting elements 222. Since theplanar region S12 of the substrate 221 is a substantially planarstructure, the adhesive member 23 formed on the planar region S12 canalso have a substantially planar surface. Accordingly, after thelight-guiding plate 21 is disposed on the adhesive member 23, theadhesive member 23 will not be easily peeled.

In one embodiment, the planar region S12 can be a substantially planarsurface structure by configuring a filled layer. The filled layer can bean electrical conductive material layer, a polymer material layer, orany of other filled layer. The material having a high electricalconductive property usually also has a high thermal conductive property.Thus, the filled layer made of electrical conductive material can assistthe heat dissipation of the light-emitting assembly 22. In someembodiments, the material of the filled layer can be the same as theelectrical conductive material (e.g. copper layer) of the componentarrangement region S11, and the manufacturing process of the planarregion S12 can be the same as the manufacturing process of the componentarrangement region S11 for forming the planar region S12. Thisconfiguration can reduce the manufacturing cost of the light-emittingassembly 22. In other words, it the materials and/or the manufacturingprocesses thereof are different, the total manufacturing cost is higher.Of course, in another embodiment, the material of the planar region S12can be different from the material of the component arrangement regionS11. In another embodiment, the Young's modulus of the filled layerranges from 6×10¹⁰ Pa (60 Gpa) to 15×10¹⁰ Pa (150 Gpa). For example, theYoung's modulus of the filled layer can be 10×10¹⁰ Pa (100 Gpa). Whenthe Young's modulus of the filled layer is lower (e.g. 6×10¹⁰ Pa), thesubstrate 221 may be easily curved or warped. When the Young's modulusof the filled layer is higher (e.g. 15×10¹⁰ Pa), the substrate 221 isnot easily deformed, so that the stress of impact or shack issubstantially absorbed by the reflective member 24 (see FIG. 1A). Thiscan increase the risk of damaging the reflective member 24.

In this embodiment, as shown in FIG. 2A, the planar region S12 has afirst width w1 (the width of the filled layer) along a direction D2,which is perpendicular to the extension direction D1. Besides, thesubstrate 221 has a second width w2 (the width of the base material2211) along the direction D2. A ratio (w1/w2) of the first width w1 tothe second width w2 ranges from 0.20 to 0.85 (0.2≤(w1/w2)≤0.85). In someembodiments, the first width w1 is between 2 mm and 5 mm (e.g. 3.5 mm),and the second width w2 is between 2.35 mm and 25 mm (e.g. 5 mm, 10 mm,or 15 mm). The width (along the direction D2) of the electricalconductive material layer (e.g. copper layer) in the componentarrangement region S11 can be between 0.6 mm and 1.2 mm.

Furthermore, referring to FIGS. 2A and 2B in view of FIG. 2C, thesubstrate 221 of this embodiment comprises a protection layer 223 a, anadhesive layer 224 a, a filled layer 225 a, a base material 2211, andelectrical conductive layers 225 b and 225 c (for example but notlimited copper layers). In some embodiments, the substrate 221 cancomprise a filled layer 225 a and electrical conductive layers 225 b and225 c (for example but not limited copper layers). The filled layer 225a and the electrical conductive layers 225 b and 225 c are disposed ontwo opposite surfaces of the base material 2211. In some embodiments,the substrate 221 can further comprise a protection layer 223 a and anadhesive layer 224 a. The adhesive layer 224 a is disposed on the filledlayer 225 a, and the protection layer 223 a is disposed on the adhesivelayer 224 a. For example, the protection layer 223 a is correspondinglydisposed on the planar region S12. In another embodiment, the substrate221 can further comprise a protection layer 223 b and an adhesive layer224 b. The adhesive layer 224 b is disposed on the electrical conductivelayer 225 b and the electrical conductive layer 225 c, and theprotection layer 223 b is disposed on the adhesive layer 224 b. As shownin FIG. 2C, the upper surface of the base material 2211 is defined as afirst surface S1, and the lower surface of the base material 2211 isdefined as a second surface S2. The protection layer 223 a, the adhesivelayer 224 a and the filled layer 225 a are disposed on the upper surface(the first surface S1) of the base material 2211. The electricalconductive layer 225 b, the electrical conductive layer 225 c, theadhesive layer 224 b, and the protection layer 223 b are disposed on thelower surface (the second surface S2) of the base material 2211. Theprotection layer 223 a is attached on the filled layer 225 a by theadhesive layer 224 a for protecting the electrical conductive layer 225a, and the protection layer 223 b is attached on the electricalconductive layers 225 b and 225 c by the adhesive layer 224 b forprotecting the electrical conductive layers 225 b and 225 c. Theprotection layer 223 a and the protection layer 223 b can comprise thesame material or different materials. The protection layer 223 a and theprotection layer 223 b can have the same thickness or differentthicknesses. This disclosure is not limited. In some embodiments, thematerials of the protection layers 223 a and 223 b can be, for examplebut not limited to, epoxy or acrylic.

In some embodiments, as shown in FIG. 2C, the thickness d5 of theprotection layer 223 a is greater than 0 μm and less than 30 μm (0μm≤d5≤30 μm). In some embodiments, the thickness d5 of the protectionlayer 223 a is greater than 10 μm and less than 26 μm (10 μm≤d5≤26 μm),such as 25 μm. In the conventional display device, the thickness of theprotection layer of the light-emitting assembly is less than 10 μm. Inthis embodiment, the thicker protection layer 223 a is provided to coverthe films or layers (filled layer 225 a). This configuration can providea better protection function, but also decrease the influence of the gap(d2 of FIGS. 2B and 2C) between the electrical conductive layers 225 band 225 c on the second surface S2 to the planar region S12 of the firstsurface S1, thereby increasing the flatness of the planar region S12. Asa result, the bubbles are not easily formed between the adhesive member23 and the substrate 221, thereby preventing the peeling off of theadhesive member 23.

Referring to FIGS. 2A to 2C, the electrical conductive layer 225 b andthe electrical conductive layer 225 c disposed on the second surface S2are electrically isolated from each other, and they are coupled to twoelectrodes of the light-emitting element 222, respectively.Specifically, the light-emitting elements 222 of this embodiment can beat least partially connected in series. FIG. 3 is a circuit diagram ofthe light-emitting element 222 according to an embodiment of thisdisclosure. In this embodiment, a part of the light-emitting elements222 disposed adjacent to each other are connected in series. Forexample, the light-emitting assembly 22 comprises forty light-emittingelements 222, and this disclosure is not limited thereto. As shown inFIG. 1B, the forty light-emitting elements 222 (No. 1 light-emittingelement, No. 2 light-emitting element, No. 3 light-emitting element, . .. , and No. 40 light-emitting element) are arranged in order along thedirection D1. As shown in FIG. 3 , the arranged order is labeled on thetop of the light-emitting elements 222. For example, the No. 2light-emitting element 222 is disposed adjacent to the No. 1light-emitting element 222 and the No. 3 light-emitting element 222. Insome embodiments, regarding the electrical connection of thelight-emitting elements 222 as shown in FIG. 3 , every tenlight-emitting elements 222 are electrically connected in series.Accordingly, four sets of light-emitting elements 222 can be obtained,and the four sets of light-emitting elements 222 are electricallyconnected in parallel. To be noted, as shown in the electricalconnection diagram of FIG. 3 , the No. 2 light-emitting element 222 islocated adjacent to the No. 12 light-emitting element 222, but in thereal case, the No. 2 light-emitting element 222 may not be locatedadjacent to the No. 12 light-emitting element 222. As shown in FIG. 2A,the planar region S12 of the first surface S1 is not configured withtraces, and the wires (the electrical conductive layers 225 b and 25 cof FIG. 2B) connecting to the positive and negative electrodes of thelight-emitting element 222 are disposed on the second surface S2 of thesubstrate 221. The filled layer 225 a and the electrical conductivelayer 225 b are electrically isolated from each other. A second gap d2is formed between the electrical conductive layers 225 b and 225 c, andthe second gap d2 can be greater than 0 mm and less than 0.3 mm (0 mm≤d2≤0.3 mm). In some embodiments, the second gap d2 can be greater than0 mm and less than 0.2 mm (0 mm≤d2≤0.2 mm), such as 0.1 mm.

In one embodiment, as shown in FIG. 2A, the electrical connection padsP1 and P2 can be electrically connected to the electrical conductivelayers (225 b, 225 c) on the second surface S2 through the electricalconductive layers 225 d and 225 e. In addition, at least one throughhole h is disposed in the component arrangement region S11, and anelectrical conductive material (not shown) is provided to fill thethrough hole h, so that the electrical conductive layers of the firstsurface S1 and the second surface S2 can be electrically connected witheach other through the through hole h. Specifically, the electricalconductive layer 225 b of the second surface S2 can be electricallyconnected with the electrical conductive layer 225 d of the firstsurface S1 through the through hole h1 (and the electrical conductivematerial therein), and the electrical conductive layer 225 c of thesecond surface S2 can be electrically connected with the electricalconductive layer 225 e of the first surface S1 through another throughhole h2 (and the electrical conductive material therein). Thus, theelectrical signals can be transmitted from the electrical conductivelayers 225 b and 225 c of the second surface S2 to the electricalconductive layers 225 d and 225 e of the first surface S1, respectively,and then be transmitted to the electrical connection pads P1 and P2 andthe positive electrodes and the negative electrodes of thelight-emitting elements 222. Accordingly, the light-emitting elements222 can be driven to emit light. To be noted, the films or layersdisposed on the planar region S12 of the first surface S1 are notprovided for conducting the light-emitting elements 222, so it is notneeded to configure the through hole on the planar region S12 forconducting the films or layers on the first surface S1 and the secondsurface S2 of the substrate 221.

The other structures of the display device 1 will be describedhereinafter. With reference to FIG. 1A, the backlight module 2 of thisembodiment further comprises a reflective member 24. In addition, thedisplay device 1 of this embodiment can further comprises a back plate11, at least one optical film 12, a frame 13, and a reflective member 24a.

The back plate 11 can be, for example but not limited to, a metal memberor a plastic member, and is configured to support the backlight module 2and prevent the impact or damage of the backlight module 2. Thereflective member 24 is disposed between the back plate 11 and thelight-guiding plate 21, and is configured to reflect the light outputtedfrom the bottom surface 213 of the light-guiding plate 21 back to thelight-guiding plate 21. This configuration can increase the lightutility. The frame 13 is disposed at one side of the light-emittingassembly 22 away from the light-guiding plate 21, and the supportingportion 131 of the frame 13 supports the display panel 3. Accordingly,the display panel 3 can be disposed correspondingly to the backlightmodule 2, and the light-emitting assembly 22 and the light-guiding plate21 can be disposed between the supporting portion 131 and the back plate11. In addition, the reflective member 24 a is disposed between thesupporting portion 131 and the light-emitting assembly 22. The relativepositions and technical contents of the light-emitting assembly 22 andthe light-guiding plate 21 can be referred to the above embodiments. Thereflective member 24 or 24 a can be a reflective plate, a reflectivesheet, a reflective film, or a coated film or layer having thereflective function. In this embodiment, the reflective member 24 or 24a can be a reflective sheet for example. The reflective member 24 or 24a contains the reflective material, which comprises, for example but notlimited to, metal, metal oxide, high-reflective paint (white paint), ortheir combinations.

At least one optical film 12 between the light-guiding plate 21 and thedisplay panel 3. The optical film 12 can be, for example but not limitedto, a brightness enhancement film, prism film, or a diffuser. Inpractice, the light output surface 212 can be configured with aplurality of optical films 12 based on the application of the backlightmodule 2. For example, FIG. 1A shows four optical films 12. The numberor application of the optical films 12 is not limited in thisdisclosure.

In the display device 1 of this disclosure, the planar region S12 of thesubstrate 221 is a substantially planar structure, so the adhesivemember 23 attached to and disposed on the planar region S12 can alsoform a substantially planar surface. Since the planar region S12 is asubstantially planar structure, the bubbles can be prevented to beformed between the adhesive member 23 and the substrate 221.Accordingly, after the light-guiding plate 21 is disposed on theadhesive member 23, the adhesive member 23 will not be easily peeled.This configuration can solve the non-uniform brightness issue (hotspots)of the display device 1 or enhance the optical performance thereof.

FIG. 4A is a circuit diagram of a light-emitting element 222 a accordingto another embodiment of this disclosure, and FIG. 4B is a top view of apart of the front surface of a substrate 221 a according to anotherembodiment of this disclosure. The circuit diagram of FIG. 4A shows thatthe light-emitting elements 222 a are crossingly connected, and FIG. 4Bshows the top view of a part of the front surface of the substrate 221 awhen the light-emitting elements 222 a are crossingly connected.

As shown in FIG. 4A, the display device also comprises fortylight-emitting elements 222 a. In some embodiments, a part of thelight-emitting elements 222 a disposed adjacent to each other areconnected in parallel. For example, the forty light-emitting elements222 a (No. 1 light-emitting element, No. 2 light-emitting element, No. 3light-emitting element, . . . , and No. 40 light-emitting element) arearranged in order along the direction D1. As shown in FIG. 4A, thearranged order is labeled on the top of the light-emitting elements 222a. For example, the No. 2 light-emitting element 222 a is disposedadjacent to the No. 1 light-emitting element 222 a. In some embodiments,the term “crossingly connection” represents that the fortylight-emitting elements 222 a with non-continuous numbers are connectedin series along the direction D1. For example, the No. 1 light-emittingelement 222 a, No. 5 light-emitting element 222 a, . . . , No. 33light-emitting element 222 a, and No. 37 light-emitting element 222 aare connected in series (totally ten light-emitting elements 222 a areconnected in series), the No. 2 light-emitting element 222 a, No. 6light-emitting element 222 a, . . . , No. 34 light-emitting element 222a, and No. 38 light-emitting element 222 a are connected in series(totally ten light-emitting elements 222 a are connected in series), andso on. Accordingly, four sets of serial connected light-emittingelements can be obtained, and then the four sets of serial connectedlight-emitting elements are connected in parallel. As shown in FIG. 4B,similarly, the planar region S12 of the first surface S1 is notconfigured with traces. Different from the embodiment of FIG. 2A, in theembodiment of FIG. 4B, the component arrangement region S11 extendstoward the direction away from the planar region S12, and the extensionarea of the component arrangement region S11 is configured for disposingthe traces used in the crossingly connection of the light-emittingelements 222. The other technical features of the substrate 221 a can bereferred to the same components of the above-mentioned substrate 221.

FIG. 4C is a top view of a part of the front surface of the substrate221 b according to another embodiment of this disclosure. The substrate221 b is substantially the same as the substrate 221 a of FIG. 4B.Different from the substrate 221 a, the electrical conductive layers 225f and 225 g of the substrate 221 b are configured with a larger area(including the extra area B). The electrical conductive layers 225 f and225 g disposed in the area B also connected to the electrical connectionpads P1 and P2, respectively, for enhancing the transmission efficiencyof the power source (the current loss is smaller due to the smallerimpedance).

The assembling procedure of the display device according to anembodiment of this disclosure will be described hereinafter withreference to FIGS. 5A and 5B in view of FIGS. 1A and 2A. FIGS. 5A and 5Bare flow charts showing the assembling procedure of the display device 1according to an embodiment of this disclosure. To be noted, additionalembodiments of this disclosure can be carried out by adding a step orsteps, reducing a step or steps, or adjusting the order of steps in theassembling procedure of FIGS. 5A and 5B.

As shown in FIGS. 1A, 2A and 5A, the assembling method of the displaydevice 1 comprises: providing a light-guiding plate 21 (step S01);providing a light-emitting assembly 22 disposed correspondingly to thelight-guiding plate 21, wherein the light-emitting assembly 22 comprisesa substrate 221 and a plurality of light-emitting elements 222, thesubstrate 221 comprises a first surface S1, the first surface S1comprises a component arrangement region S11 and a planar region S12, afirst gap d1 is formed between the planar region S12 and the componentarrangement region S11, the planar region S12 and the componentarrangement region S11 are electrically isolated from each other, andthe light-emitting elements 222 are disposed on the componentarrangement region S11 (step S02); disposing an adhesive member 23 onthe planar region S12 or the light-guiding plate 21 (step S03); anddisposing the light-guiding plate 21 on the planar region S12 andconnecting the light-guiding plate 21 and the planar region S12 of thesubstrate 221 by the adhesive member 23 (step S04). In some embodiments,the light-emitting assembly 22 can be disposed on the back plate 11. Thelight-emitting assembly 22 can be assembled in advance and then disposedon the back plate 11. Afterwards, the reflective member 24 can beoptionally disposed on the back plate 11, so the reflective member 24can be disposed adjacent to the light-emitting assembly 22. In someembodiments, the step S02 can further dispose the adhesive member 23 onthe planar region S12, and the step S03 can be removed.

In addition, as shown in FIG. 5B, the assembling method of the displaydevice 1 can further comprise: disposing a frame 13 at one side of thelight-emitting assembly 22 away from the light-guiding plate 21, andproviding a reflective member 24 a between the frame 13 and thelight-emitting assembly 22 (step S05). Herein, the reflective member 24a can be disposed under the supporting portion 131 of the frame 13, andthen the frame 13 along with the reflective member 24 a can be moved tothe light-emitting assembly 22 and the light-guiding plate 21, therebydisposing the reflective member 24 a between the supporting portion 131and the back plate 11. Moreover, the assembling method of the displaydevice 1 can further comprise: disposing at least an optical film 12 onthe light-guiding plate 21 (step S06); and disposed a display panel 3 onthe supporting portion 131 of the frame 13 (step S07). Accordingly, thedisplay panel 3 can be disposed correspondingly to the backlight module2.

FIG. 6 is a schematic diagram showing a display device 1 a according toanother embodiment of this disclosure. The assembling procedure of thedisplay device 1 a as shown in FIG. 6 comprises: disposing a reflectivemember 24 on a back plate 11; disposing a frame 13 on the back plate 11and attaching the frame 13 on the inner side wall 111 of the back plate11; assembling a light-guiding plate 21, an adhesive member 23, alight-emitting assembly 22 a and another adhesive member 28 (e.g. ashielding tape), wherein the light-emitting elements 222 are disposedaway from the surface F of the substrate 221, facing downwardly, andconfigured on the reflective member 24 (i.e. the light-emitting assembly22 a is reversed on the reflective member 24), and the reflective member24 is disposed between the light-guiding plate 21 and the back plate 11;disposing at least an optical film 12 on the light-guiding plate 21,wherein the substrate 221 of the light-emitting assembly 22 a supportsthe at least one optical film 12; and disposing a display panel 3 on theadhesive member 18 and the at least one optical film 12, wherein theoptical film 12 is disposed between the display panel 3 and thelight-guiding plate 21.

As mentioned above, in the display device and assembling method thereofof this disclosure, the first surface of the substrate of the backlightmodule comprises a component arrangement region and a planar region, theplanar region and the component arrangement region are electricallyisolated from each other by a gap disposed therebetween, and theadhesive member connects the light-guiding plate and the planar region.Since the planar region of the substrate is a substantially planarstructure, the bubbles can be prevented to be formed in the adhesivemember so as to obtain a substantially planar surface. Accordingly,after the light-guiding plate is disposed on the adhesive member, theadhesive member will not be easily peeled, thereby solving thenon-uniform brightness issue (hotspots) or enhancing the opticalperformance.

Although the disclosure has been described with reference to specificembodiments, this description is not meant to be construed in a limitingsense. Various modifications of the disclosed embodiments, as well asalternative embodiments, will be apparent to persons skilled in the art.It is, therefore, contemplated that the appended claims will cover allmodifications that fall within the true scope of the disclosure.

What is claimed is:
 1. A light-emitting assembly comprises: a substratecomprising a component arrangement region and a planar region in a topview; and in a sectional view comprising a base material layer, a filledlayer disposed on the base material layer, and a protection layerdisposed on the filled layer; wherein a thickness of the filled layer isgreater than a thickness of the protection layer, and the thickness ofthe protection layer is greater than 0 μm and less than 30 μm; and aplurality of light-emitting elements located on the componentarrangement region.
 2. The light-emitting assembly according to claim 1,wherein the plurality of light-emitting elements are arranged along anextension direction, wherein the planar region of the substrate has afirst width along a direction perpendicular to the extension direction,the substrate has a second width along the direction, and a ratio of thefirst width to the second width ranges from 0.20 to 0.85.
 3. Thelight-emitting assembly according to claim 1, wherein a first gap isformed between the planar region and the component arrangement region ofthe substrate, and the first gap is greater than 0 mm and less than 0.3mm.
 4. The light-emitting assembly according to claim 1, furthercomprising at least one of electrical connection pads, wherein a minimumdistance (d3) between the planar region of the substrate and the atleast one of the electrical connection pads is between 0.075 mm and 0.3mm (0.075 mm≤d3≤0.3 mm).
 5. The light-emitting assembly according toclaim 1, wherein a part of the plurality of light-emitting elementsdisposed adjacent to each other are electrically connected in series. 6.The light-emitting assembly according to claim 1, wherein a part of theplurality of light-emitting elements disposed adjacent to each other areelectrically connected in parallel.
 7. The light-emitting assemblyaccording to claim 1, wherein the substrate further comprises anelectrical conductive layer and the electrical conductive layer isdisposed on two opposite surfaces of the base material layer.
 8. Thelight-emitting assembly according to claim 1, wherein the filled layeris an electrical conductive material layer.
 9. The light-emittingassembly according to claim 8, wherein the material of the filled layeris the same as the electrical conductive material of the componentarrangement region.
 10. The light-emitting assembly according to claim1, wherein the substrate further comprises an adhesive layer disposedbetween the filled layer and the protection layer.
 11. Thelight-emitting assembly according to claim 1, wherein the light-emittingassembly is disposed correspondingly to a light-guiding plate.
 12. Thelight-emitting assembly according to claim 11, wherein the light-guidingplate comprises a light input surface and a light output surface. 13.The light-emitting assembly according to claim 12, wherein the pluralityof light-emitting elements are located correspondingly to the lightinput surface of the light-guiding plate.
 14. The light-emittingassembly according to claim 13, wherein a light emitted from thelight-emitting assembly enters the light-guiding plate through the lightinput surface, and exits the light-guiding plate through the lightoutput surface.
 15. The light-emitting assembly according to claim 11,wherein the light-guiding plate is partially disposed on the planarregion.
 16. The light-emitting assembly according to claim 15, whereinthe light-guiding plate connects the planar region by an adhesivemember.